| Flash Type | MLC | aSLC |
|---|---|---|
| Flash Process | Samsung 14nm | Samsung 14nm aSLC mode |
| Series | PHANES-EA | PHANES-EA |
| Picture |  |
|
| Capacity | 8GB, 16GB | 4GB, 8GB |
| Package | 153 Ball FFBGA(TFFBGA) Package | 153 Ball FFBGA(TFFBGA) Package |
| Compatibility | eMMC Specification Ver.4.4~5.1 | eMMC Specification Ver.4.4~5.1 |
| Bus mode | - High-speed eMMC protocol. - Clock frequency: 0-200MHz. - Ten-wire bus (clock, 1 bit command, 8 bit data bus) and a hardware reset. |
- High-speed eMMC protocol. - Clock frequency: 0-200MHz. - Ten-wire bus (clock, 1 bit command, 8 bit data bus) and a hardware reset. |
| 3 data bus widths | - Single data rate : up to 200Mbyte/s @ 200MHz - Dual data rate : up to 400Mbyte/s @ 200MHz - 8 parallel data rate : up to 52Mbyte/s @ 52 MHz (Default) |
- Single data rate : up to 200Mbyte/s @ 200MHz - Dual data rate : up to 400Mbyte/s @ 200MHz - 8 parallel data rate : up to 52Mbyte/s @ 52 MHz (Default) |
| Operating temp. (STD.Grade) |
S : 0˚C~+85˚C | S : 0˚C~+85˚C |
| Power requirement | - Core Voltage (VCC): 2.7-3.6V - I/O (VCCQ) Voltage: 1.7-1.95V/2.7-3.6V |
- Core Voltage (VCC): 2.7-3.6V - I/O (VCCQ) Voltage: 1.7-1.95V/2.7-3.6V |
| Weight (Max.) | 2g | 2g |
| Package Dimension(WxLxH,mm) | 11.5 x 13.0 x 1.0 (mm) | 11.5 x 13.0 x 1.0 (mm) |
| Warranty (Std./Ind.) | MLC 2 years / Within 3K Erasing Counts | aSLC Mode 2 years / Within 20K Erasing Counts |
| Flash Type | MLC |
|---|---|
| Flash Process | Samsung 14nm |
| Series | PHANES-EA |
| Picture | |
| Capacity | 8GB, 16GB |
| Package | 153 Ball FFBGA(TFFBGA) Package |
| Compatibility | eMMC Specification Ver.4.4~5.1 |
| Bus mode | - High-speed eMMC protocol. - Clock frequency: 0-200MHz. - Ten-wire bus (clock, 1 bit command, 8 bit data bus) and a hardware reset. |
| 3 data bus widths | - Single data rate : up to 200Mbyte/s @ 200MHz - Dual data rate : up to 400Mbyte/s @ 200MHz - 8 parallel data rate : up to 52Mbyte/s @ 52 MHz (Default) |
| Operating temp. (STD.Grade) |
S : 0˚C~+85˚C |
| Power requirement | - Core Voltage (VCC): 2.7-3.6V - I/O (VCCQ) Voltage: 1.7-1.95V/2.7-3.6V |
| Weight (Max.) | 2g |
| Package Dimension(WxLxH,mm) | 11.5 x 13.0 x 1.0 (mm) |
| Warranty (Std./Ind.) | MLC 2 years / Within 3K Erasing Counts |
| Flash Type | aSLC |
|---|---|
| Flash Process | Samsung 14nm aSLC mode |
| Series | PHANES-EA |
| Picture | |
| Capacity | 4GB, 8GB |
| Package | 153 Ball FFBGA(TFFBGA) Package |
| Compatibility | eMMC Specification Ver.4.4~5.1 |
| Bus mode | - High-speed eMMC protocol. - Clock frequency: 0-200MHz. - Ten-wire bus (clock, 1 bit command, 8 bit data bus) and a hardware reset. |
| 3 data bus widths | - Single data rate : up to 200Mbyte/s @ 200MHz - Dual data rate : up to 400Mbyte/s @ 200MHz - 8 parallel data rate : up to 52Mbyte/s @ 52 MHz (Default) |
| Operating temp. (STD.Grade) |
S : 0˚C~+85˚C |
| Power requirement | - Core Voltage (VCC): 2.7-3.6V - I/O (VCCQ) Voltage: 1.7-1.95V/2.7-3.6V |
| Weight (Max.) | 2g |
| Package Dimension(WxLxH,mm) | 11.5 x 13.0 x 1.0 (mm) |
| Warranty (Std./Ind.) | aSLC Mode 2 years / Within 20K Erasing Counts |
| Flash Type | MLC | aSLC |
|---|---|---|
| Flash Process | Samsung 14nm | Samsung 14nm aSLC mode |
| Series | PHANES-EA | PHANES-EA |
| Picture | |
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| SpecSheet | ||
| DataSheet | ||
| Dimension |
