Page 85 - APRO_2020_Catalog

A20096 MUSE-F Series MLC M.2 2242 & 2280 PCIe SSD (MDP) NEW!

 Features
 MLC-NAND flash technology
 M.2 2242 / 2280 form-factor
 Support Trim command set
 Support Native Command Queuing (NCQ)
 Support LDPC (Low Density Parity Check) ECC algorithm.
 Ultra-high random read/write speed
 Support S.M.A.R.T. command set and utility
 M.2 2242 capacities from 32GB up to 256GB
 M.2 2280 capacities from 32GB up to 512GB
 Specification
 Compatibility NVM ExpressTM 1.3 Standard &  Power consumption
PCI Express® Base Specification Rev 3.0  Power requirement +3.3V ± 5%
 Declarations RoHS & REACH compliant  Reading mode 2242 : 755 mA (Max.); 2280 : 845 mA (Max.) SLC
 Flash technology MLC-NAND flash technology  Writing mode 2242 : 830 mA (Max.); 2280 : 1,130 mA (Max.)
 Form-factor M.2 2242-D3-B-M  Idle mode 2242 : 365 mA (Max.); 2280 : 380 mA (Max.)
M.2 2280-D5-B-M  Reliability
 Host interface M.2 keying notches in B and M positions  Wear-leveling Static wear-leveling algorithms
 Performance  TBW Up to 390 TBW at 512GB Capacity
 Data transfer rate PCI Gen3 x 2 NVMe interface(2242/2280) (Client workload by JESD-219A)
 Sequential read 2242: 1,300 MB/s (Max.); 2280: 1,200 MB/s(Max.)  Erase counts Up to 3,000 times
 Sequential write 2242: 340 MB/s (Max.); 2280: 480 MB/s(Max.)  ECC LDPC (Low Density Parity Check) aSLC
 4KB random read 2242:51K IOPS (Max.); 2280: 51K IOPS (Max.)c  Physical specification
 4KB random write 2242: 47K IOPS (Max.); 2280: 50K IOPS (Max.)  Weight (Max.) 2242 : 8g
 Environmental 2280 : 10g
 Operating temp. STD. 0˚C~+70˚C/W.T. -40˚C~+85˚C  Dimension (WxL) 2242 : 22.00 x 42.00 (mm)
 Non-operating temp. STD. -20˚C~+80˚C/W.T. -50˚C~+95˚C 2280 : 22.00 x 80.00 (mm)
 Humidity 10% ~ 95% non-condensing  Conformal coating Optional
 Vibration 70 Hz to 2K Hz, 20G, 3 axes  Warranty 2 years or within 3,000 erasing counts
 Shock 0.5ms, 1500G, 3 axes MLC
 Altitude 70,000 feet
 Part Number List
M.2 2242 PCIe Module M.2 2280 PCIe Module
Capacity 0ºC~+70ºC -40ºC~+85ºC Capacity 0ºC~+70ºC -40ºC~+85ºC
32GB SBMDP032G-VFCTM-4BM WBMDP032G-VFCTM-4BMC 32GB SBMDP032G-VFCTM-8BM WBMDP032G-VFCTM-8BMC
64GB SBMDP064G-VFCTM-4BM WBMDP064G-VFCTM-4BMC 64GB SBMDP064G-VFCTM-8BM WBMDP064G-VFCTM-8BMC 3D-NAND
128GB SBMDP128G-VFCTM-4BM WBMDP128G-VFCTM-4BMC 128GB SBMDP128G-VFCTM-8BM WBMDP128G-VFCTM-8BMC
256GB SBMDP256G-VFCTM-4BM WBMDP256G-VFCTM-4BMC 256GB SBMDP256G-VFCTM-8BM WBMDP256G-VFCTM-8BMC
512GB SBMDP512G-VFCTM-8BM WBMDP512G-VFCTM-8BMC

 Part Number Decoder
X1 X2 X3 X4 X5 X6 X7 X8 X9 X10 X11 X12 X13 X14 X15 X16 X17 X18 X19 X20
Example 1 Module DRAM
W B M D P 2 5 6 G V F C T M 4 B M C
Example 2
W B M D P 5 1 2 G V F C T M 8 B M C

X1 Grade X13 Controller grade Adapter
S : Standard grade operating temp. 0ºC~+70ºC C : Commercial grade
W : Wide temp. grade operating temp. -40ºC~+85ºC
X14 Flash IC brand
X2 The material of casing
T : Toshiba NAND flash IC
B : Bare (without casing)
X15 Form-factor type
X3 X4 X5 Product category
M : MLC-NAND flash IC
MDS : M.2 PCIe Module Card-drive
X17 X18 X19 Form Factor Type
X6 X7 X8 X9 Capacity
4 : 2242 form factor
032G : 32GB 256G : 256GB 8 : 2280 form factor
064G : 64GB 512G : 512GB BM : B + M Key
128G : 128GB
X20 Reserved for specific requirements
X11 Controller
C : Conformal coating (optional)
V : MUSE Series
X12 Controller version
A, B, C, D, F…..

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Product specifications are subject to change without prior notice.