Page 84 - APRO_2020_Catalog

A19057 PHANES-K Series MLC M.2 2242 & 2280 SATA III SSD (MDS)

 Features
 MLC-NAND flash technology
 M.2 2242 / 2280 form-factor
 Support Trim command set
 Support Native Command Queuing (NCQ)
 Support LDPC (Low Density Parity Check) ECC algorithm.
 Support S.M.A.R.T. command set and utility
 Support Power Loss Protection
 M.2 2242 capacities from 8GB up to 256GB
 M.2 2280 capacities from 8GB up to 512GB
 Specification
 Compatibility SATA Revision 3.2  Power consumption
SLC  Declarations ATA-8 ACS4 command set  Power requirement +3.3V ± 5%
RoHS & REACH compliant
1,500 mW (Max.)
Reading mode

 Flash technology MLC-NAND flash technology  Writing mode 2,650 mW (Max.)
 Form-factor M.2 2242-D3-B-M  Idle mode 280 mW (Max.)
M.2 2280-D5-B-M  Reliability
 Host interface Compatible with PCI Express™ M.2  Wear-leveling Static and Dynamic wear-leveling algorithms
B + M Key  TBW Up to 540 TBW at 512GB Capacity
 Performance (Client workload by JESD-219A)
aSLC  Data transfer rate SATA 1.5Gb/s, 3.0Gb/s, 6.0Gb/s  Erase counts Up to 3,000 times
Sequential read
ECC
LDPC (Low Density Parity Check)
550 MB/sec (Max.)


490 MB/sec (Max.)
Physical specification

Sequential write

 Environmental  Weight (Max.) 2242 : 5g
 Operating temp. STD. 0˚C~+70˚C/W.T. -40˚C~+85˚C 2280 : 8g
 Non-operating temp. STD. -20˚C~+80˚C/W.T. -50˚C~+95˚C  Dimension (WxL) 2242 : 22.00 x 42.00 (mm)
 Humidity 10% ~ 95% non-condensing 2280 : 22.00 x 80.00 (mm)
 Vibration 80 Hz to 2K Hz, 20G, 3axes  Conformal coating Optional


Shock
0.5ms, 1500G, 3 axes
Warranty
2 years or within 3,000 erasing counts
MLC  Altitude 70,000 feet
 Part Number List
M.2 2242 SATA Module M.2 2280 SATA Module
0ºC~+70ºC
-40ºC~+85ºC
0ºC~+70ºC
-40ºC~+85ºC
Capacity SBMDS008G-PKCTM4BM(T) WBMDS008G-PKCTM4BM(T)C Capacity SBMDS008G-PKCTM8BM(T) WBMDS008G-PKCTM8BM(T)C
8GB
8GB
3D-NAND 128GB SBMDS016G-PKCTM4BM(T) WBMDS016G-PKCTM4BM(T)C 128GB SBMDS016G-PKCTM8BM(T) WBMDS016G-PKCTM8BM(T)C
16GB
16GB
32GB
WBMDS032G-PKCTM4BM(T)C
WBMDS032G-PKCTM8BM(T)C
SBMDS032G-PKCTM8BM(T)
32GB
SBMDS032G-PKCTM4BM(T)
64GB
WBMDS064G-PKCTM4BM(T)C
SBMDS064G-PKCTM8BM(T)
SBMDS064G-PKCTM4BM(T)
WBMDS064G-PKCTM8BM(T)C
64GB
WBMDS128G-PKCTM4BM(T)C
WBMDS128G-PKCTM8BM(T)C
SBMDS128G-PKCTM4BM(T)
SBMDS128G-PKCTM8BM(T)
SBMDS256G-PKCTM4BM(T)
256GB
256GB
WBMDS256G-PKCTM4BM(T)C
512GB SBMDS256G-PKCTM8BM(T) WBMDS256G-PKCTM8BM(T)C
SBMDS512G-PKCTM8BM(T)
WBMDS512G-PKCTM8BM(T)C
 Part Number Decoder
DRAM Module Example 1 X3 X4 X5 X6 X7 X8 X9 X10 X11 X12 X13 X14 X15 X16 X17 X18 X19 X20
X1
X2
W
B
Example 2 M D S 2 5 6 G P K C T M 4 B M T C
W B M D S 5 1 2 G P K C T M 8 B M T C
Adapter S : Standard grade operating temp. 0ºC~+70ºC C : Commercial grade
Grade
Controller grade
X1
X13
W : Wide temp. grade operating temp. -40ºC~+85ºC
X2 The material of casing X14 Flash IC brand
T : Toshiba NAND flash IC
B : Bare (without casing)
Card-drive MDS : M.2 SATA SSD Product category M : MLC-NAND flash IC Form-factor type
Flash IC type
X15
X5
X4
X3
X17
X16
X18
Capacity
X8
X9
X6
X7
008G : 8GB
8 : 2280 form factor
128G : 128GB
016G : 16GB 064G : 64GB 512G : 512GB 4 : 2242 form factor
BM : B + M Key
032G : 32GB 256G : 256GB
X19 X20 Reserved for specific requirements
X11 Controller
Blank : Standard product w/o thermal sensor and conformal-coating
P : PHANES Series T : Thermal Sensor (optional)
X12 Controller version C : Conformal coating (optional)
A, B, C, D…..
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Product specifications are subject to change without prior notice.