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A19056 MUSE-D Series MLC M.2 2242 & 2280 SATA III SSD (MDS)
Features
MLC-NAND flash technology
M.2 2242 / 2280 form-factor
Support Trim command set
Support Native Command Queuing (NCQ)
Support LDPC (Low Density Parity Check) ECC algorithm.
Ultra-high random read/write speed
Support S.M.A.R.T. command set and utility
M.2 2242 capacities from 8GB up to 128GB
M.2 2280 capacities from 8GB up to 256GB
Specification
Compatibility SATA Revision 3.1 Altitude 70,000 feet
ATA-8 command set Power consumption
Declarations RoHS & REACH compliant Power requirement +3.3V ± 5% SLC
Flash technology MLC-NAND flash technology Reading mode 2242 : 210 mA (Max.); 2280 : 250 mA (Max.)
Form-factor M.2 2242-D3-B-M Writing mode 2242 : 220 mA (Max.); 2280 : 290 mA (Max.)
M.2 2280-D5-B-M Idle mode 2242 : 100 mA (Max.); 2280 : 110 mA (Max.)
Host interface Compatible with PCI Express™ M.2 Reliability
B + M Key Wear-leveling Static wear-leveling algorithms
Performance TBW Up to 416 TBW at 256GB Capacity
Data transfer rate SATA 1.5Gb/s, 3.0Gb/s, 6.0Gb/s (Client workload by JESD-219A)
Sequential read 2242 : 550 MB/s (Max.); 2280 : 570 MB/s(Max.) Erase counts Up to 3,000 times aSLC
Sequential write 2242 : 130 MB/s (Max.); 2280 : 150 MB/s(Max.) ECC LDPC (Low Density Parity Check)
4KB random read 2242 : 32K IOPS (Max.); 2280 : 32K IOPS (Max.)c Physical specification
4KB random write 2242 : 29K IOPS (Max.); 2280 : 26K IOPS (Max.) Weight (Max.) 2242 : 5g
Environmental 2280 : 8g
Operating temp. STD. 0˚C~+70˚C/W.T. -40˚C~+85˚C Dimension (WxL) 2242 : 22.00 x 42.00 (mm)
Non-operating temp. STD. -20˚C~+80˚C/W.T. -50˚C~+95˚C 2280 : 22.00 x 80.00 (mm)
Humidity 10% ~ 95% non-condensing Conformal coating Optional
Vibration 70 Hz to 2K Hz, 20G, 3 axes Warranty 2 years or within 3,000 erasing counts MLC
Shock 0.5ms, 1500G, 3 axes
Part Number List
M.2 2242 SATA Module M.2 2280 SATA Module
Capacity 0ºC~+70ºC -40ºC~+85ºC Capacity 0ºC~+70ºC -40ºC~+85ºC
8GB SBMDS008G-VDCTM4BM(T) WBMDS008G-VDCTM4BM(T)C 8GB SBMDS008G-VDCTM8BM(T) WBMDS008G-VDCTM8BM(T)C
16GB SBMDS016G-VDCTM4BM(T) WBMDS016G-VDCTM4BM(T)C 16GB SBMDS016G-VDCTM8BM(T) WBMDS016G-VDCTM8BM(T)C 3D-NAND
32GB SBMDS032G-VDCTM4BM(T) WBMDS032G-VDCTM4BM(T)C 32GB SBMDS032G-VDCTM8BM(T) WBMDS032G-VDCTM8BM(T)C
64GB SBMDS064G-VDCTM4BM(T) WBMDS064G-VDCTM4BM(T)C 64GB SBMDS064G-VDCTM8BM(T) WBMDS064G-VDCTM8BM(T)C
128GB SBMDS128G-VDCTM4BM(T) WBMDS128G-VDCTM4BM(T)C 128GB SBMDS128G-VDCTM8BM(T) WBMDS128G-VDCTM8BM(T)C
256GB SBMDS256G-VDCTM8BM(T) WBMDS256G-VDCTM8BM(T)C
Part Number Decoder
X1 X2 X3 X4 X5 X6 X7 X8 X9 X10 X11 X12 X13 X14 X15 X16 X17 X18 X19 X20
Example 1 Module DRAM
W B M D S 1 2 8 G V D C T M 4 B M T C
Example 2
W B M D S 2 5 6 G V D C T M 8 B M T C
X1 Grade X13 Controller grade Adapter
S : Standard grade operating temp. 0ºC~+70ºC C : Commercial grade
W : Wide temp. grade operating temp. -40ºC~+85ºC
X14 Flash IC brand
X2 The material of casing
T : Toshiba NAND flash IC
B : Bare (without casing)
X15 Form-factor type
X3 X4 X5 Product category
M : MLC-NAND flash IC
MDS : M.2 SATA SSD Card-drive
X16 X17 X18 Form Factor Type
X6 X7 X8 X9 Capacity
4 : 2242 form factor
008G : 8GB 064G : 64GB 8 : 2280 form factor
016G : 16GB 128G : 128GB BM : B + M Key
032G : 32GB 256G : 256GB
X19 X20 Reserved for specific requirements
X11 Controller
Blank : Standard product w/o thermal sensor and conformal-coating
V : MUSE Series T : Thermal Sensor (optional)
C : Conformal coating (optional)
X12 Controller version
A, B, C, D…..
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Product specifications are subject to change without prior notice.

