Page 63 - APRO_2020

Page 63 - APRO_2020_Catalog

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A20095 PHANES-K Series aSLC M.2 2242 & 2280 SATA III SSD (MDS) NEW!

 Features
 Enhanced MLC-NAND ﬂash by sophisticated aSLC ﬁrmware
 M.2 2242 / 2280 form-factor
 Support Trim command set
 Support Native Command Queuing (NCQ)
 Support LDPC (Low Density Parity Check) ECC algorithm.
 Support S.M.A.R.T. command set and utility
 Support Power Loss Protection
 M.2 2242 capacities from 8GB up to 128GB
 M.2 2280 capacities from 8GB up to 256GB
 Speciﬁcation
 Compatibility SATA Revision 3.2  Power consumption
ATA-8 ACS4 command set  Power requirement +3.3V ± 5%
 Declarations RoHS & REACH compliant  Reading mode 1,500 mW (Max.) SLC
 Flash technology MLC-NAND ﬂash technology  Writing mode 2,650 mW (Max.)
 Form-factor M.2 2242-D3-B-M  Idle mode 318 mW (Max.)
M.2 2280-D5-B-M  Reliability
 Host interface Compatible with PCI Express™ M.2  Wear-leveling Static and Dynamic wear-leveling algorithms
B + M Key  TBW Up to 1,510 TBW at 256GB Capacity
 Performance (Client workload by JESD-219A)
 Data transfer rate SATA 1.5Gb/s, 3.0Gb/s, 6.0Gb/s  Erase counts Up to 3,000 times
 Sequential read 550 MB/sec (Max.)  ECC LDPC (Low Density Parity Check) aSLC
 Sequential write 490 MB/sec (Max.)  Physical speciﬁcation
 Environmental  Weight (Max.) 2242 : 5g
 Operating temp. STD. 0˚C~+70˚C/W.T. -40˚C~+85˚C 2280 : 8g
 Non-operating temp. STD. -20˚C~+80˚C/W.T. -50˚C~+95˚C  Dimension (WxL) 2242 : 22.00 x 42.00 (mm)
 Humidity 10% ~ 95% non-condensing 2280 : 22.00 x 80.00 (mm)
 Vibration 80 Hz to 2K Hz, 20G, 3axes  Conformal coating Optional
 Shock 0.5ms, 1500G, 3 axes  Warranty 2 years or within 20,000 erasing counts
 Altitude 70,000 feet MLC
 Part Number List
M.2 2242 SATA Module M.2 2280 SATA Module
Capacity 0ºC~+70ºC -40ºC~+85ºC Capacity 0ºC~+70ºC -40ºC~+85ºC
8GB SBMDS008G-PKCTMAS4BM WBMDS008G-PKCTMAS4BMC 8GB SBMDS008G-PKCTMAS8BM WBMDS008G-PKCTMAS8BMC
16GB SBMDS016G-PKCTMAS4BM WBMDS016G-PKCTMAS4BMC 16GB SBMDS016G-PKCTMAS8BM WBMDS016G-PKCTMAS8BMC
32GB SBMDS032G-PKCTMAS4BM WBMDS032G-PKCTMAS4BMC 32GB SBMDS032G-PKCTMAS8BM WBMDS032G-PKCTMAS8BMC 3D-NAND
64GB SBMDS064G-PKCTMAS4BM WBMDS064G-PKCTMAS4BMC 64GB SBMDS064G-PKCTMAS8BM WBMDS064G-PKCTMAS8BMC
128GB SBMDS128G-PKCTMAS4BM WBMDS128G-PKCTMAS4BMC 128GB SBMDS128G-PKCTMAS8BM WBMDS128G-PKCTMAS8BMC
256GB SBMDS256G-PKCTMAS8BM WBMDS256G-PKCTMAS8BMC

 Part Number Decoder
X1 X2 X3 X4 X5 X6 X7 X8 X9 X10 X11 X12 X13 X14 X15 X16 X17 X18 X19 X20
Example 1 Module DRAM
W B M D S 1 2 8 G P K C T M A S 4 B M
Example 2
W B M D S 2 5 6 G P K C T M A S 8 B M

X1 Grade X13 Controller grade
S : Standard grade operating temp. 0ºC~+70ºC C : Commercial grade Adapter
W : Wide temp. grade operating temp. -40ºC~+85ºC
X14 Flash IC brand
X2 The material of casing
T : Toshiba NAND ﬂash IC
B : Bare (without casing)
X15 Flash IC type
X3 X4 X5 Product category
M : MLC-NAND ﬂash IC
MDS : M.2 SATA SSD
X16 X17 aSLC Technology
X6 X7 X8 X9 Capacity Card-drive
AS : aSLC Technology extends MLC products’ lifespan
008G : 8GB 064G : 64GB X18 X19 X20 Form-factor type
016G : 16GB 128G : 128GB
032G : 32GB 256G : 256GB 4 : 2242 form factor
X11 Controller 8 : 2280 form factor
BM : B + M Key
P : PHANES Series X21 Reserved for speciﬁc requirements
X12 Controller version
Blank : Standard product w/o thermal sensor and conformal-coating
A, B, C, D….. T : Thermal Sensor (optional)
C : Conformal coating (optional)

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Product speciﬁcations are subject to change without prior notice.

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