Page 65 - APRO_2019_Catalog

A19040 HERMIT-E Series aSLC USB 3.0 Flash Disk Generation 3EL (G3EL)

 Features

 Enhanced MLC-NAND flash by sophisticated aSLC firmware
 Semi-metal casing design
 Ultra-high random read/write speed
 Support S.M.A.R.T. command set and utility
 Customized logo by laser carving (MOQ requested)
 Capacities from 4GB up to 256GB
 Specification
 Compatibility USB 3.1  Power consumption
 Declarations RoHS & REACH compliant  Power requirement 5V ± 10% via USB port
 Flash technology MLC-NAND flash technology  Reading mode 203 mA(Max.) SLC
 Form-factor Pen drive  Writing mode 189.8 mA(Max.)
 Host interface 9 pins USB 3.0 Type A connector  Idle mode 40.2 mA(Max.)
 Performance  Reliability
 Data transfer rate FullSpeed, HighSpeed and SuperSpeed  Wear-leveling Dynamic, Static and Global wear-leveling
 Sequential read 147.7 MB/sec (Max.) algorithms
 Sequential write 118.3 MB/sec (Max.)  TBW Up to 503 TBW at 256GB Capacity
 4KB random read 14.4 MB/sec (Max.) (Client workload by JESD-219A)
 4KB random write 11.2 MB/sec (Max.)  Erase counts Up to 20,000 times aSLC
 Environmental  ECC 96 bits per 1024 bytes block
 Operating temp. STD. 0˚C~+70˚C/W.T. -40˚C~+85˚C  Physical specification
 Non-operating temp. STD. -20˚C~+80˚C/W.T. -50˚C~+95˚C  Weight (Max.) 15g
 Humidity 10%~95% non-condensing  Dimension (WxLxH) 17.60 x 62.10 x 8.40 (mm).
 Vibration 70 Hz to 2K Hz, 15G, 3 axes  Conformal coating Optional
 Shock 0.5ms, 1500G, 3 axes  Warranty 2 years or within 20,000 erasing counts
 Altitude 70,000 feet
 OS supported Windows series Embedded O.S. MLC
Linux, VxWorks and DOS
 Part Number List
Capacity 0ºC~+70ºC Capacity -40ºC~+85ºC
4GB SMUFD004G-HECTMBAS 4GB WMUFD004G-HECTMBASC
8GB SMUFD008G-HECTMBAS 8GB WMUFD008G-HECTMBASC
16GB SMUFD016G-HECTMBAS 16GB WMUFD016G-HECTMBASC
32GB SMUFD032G-HECTMBAS 32GB WMUFD032G-HECTMBASC 3D-NAND
64GB SMUFD064G-HECTMBAS 64GB WMUFD064G-HECTMBASC
128GB SMUFD128G-HECTMBAS 128GB WMUFD128G-HECTMBASC
256GB SMUFD256G-HECTMBAS 256GB WMUFD256G-HECTMBASC

 Part Number Decoder
X1 X2 X3 X4 X5 X6 X7 X8 X9 X10 X11 X12 X13 X14 X15 X16 X17 X18 X19 X20
Example Module DRAM
W M U F D 2 5 6 G H E C T M B A S C

X1 Grade X13 Controller grade
S : Standard grade operating temp. 0ºC~+70ºC C : Commercial grade
W : Wide temp. grade operating temp. -40ºC~+85ºC
X14 Flash IC brand
X2 The material of casing Adapter
T : Toshiba NAND flash IC
M : Semi-metal casing
X15 Flash IC type
X3 X4 X5 Product category
M : MLC-NAND flash IC
UFD : USB Flash Disk
X16 MLC Technology
X6 X7 X8 X9 Capacity
B : Toshiba 15nm MLC
004G : 4GB 064G : 64GB aSLC Technology Card-drive
008G : 8GB 128G : 128GB X17 X18
016G : 16GB 256G : 256GB AS : aSLC Technology extends MLC products’ lifespan
032G : 32GB
X19 X20 Reserved for specific requirements
X11 Controller C : Conformal coating (optional)
H : HERMIT Series
X12 Controller version
A, B, C, D…..

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Product specifications are subject to change without prior notice.