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A19036     PHANES-K Series  aSLC mSATA III SSD (MSM)

                                                               Features
                                                                Enhanced MLC-NAND flash by sophisticated aSLC firmware
                                                                Support Trim command set
                                                                Support Native Command Queuing (NCQ)
                                                                Support LDPC (Low Density Parity Check) ECC algorithm
                                                                Support S.M.A.R.T. command set and utility
                                                                Support Power Loss Protection
                                                                Capacities from 8GB up to 256GB
               Specification
               Compatibility    SATA Revision 3.2              Power consumption
                                 ATA-8 ACS4 command set         Power requirement  +3.3 V ± 5%
               Declarations     RoHS & REACH compliant         Reading mode    1,615mW (Max.)                     SLC
               Flash technology  MLC-NAND flash technology      Writing mode    1,960mW (Max.)
               Form-factor      Standard mSATA form factor     Idle mode       275mW (Max.)
                                 Compliant with JEDEC MO-300A    Reliability
               Host Interface   mini PCI-e connector with 52 pins    Wear-leveling  Static and Dynamic  wear-leveling algorithms
                                 SATA pin out                   TBW             Up to 1,510 TBW at 256GB Capacity.
               Performance                                                      (Client workload by JESD-219A)
               Data transfer rate  SATA 1.5Gb/s, 3.0Gb/s, 6.0Gb/s    Erase counts  Up to 20,000 times
               Sequential read  550 MB/sec (Max.)              ECC             LDPC (Low Density Parity Check)    aSLC
               Sequential write  490 MB/sec (Max.)             Physical specification
               Environmental                                   Weight (Max.)   8g
               Operating temp.  STD. 0˚C~+70˚C/W.T. -40˚C~+85˚C    Dimension (WxL)  29.85 x 50.80 (mm)
               Non-operating temp  STD. -20˚C~+80˚C/W.T. -50˚C~+95˚C    Conformal coating  Optional
               Humidity         10% ~ 95% non-condensing       Warranty        2 years or within 20,000 erasing counts
               Vibration        80 Hz to 2K Hz, 20G, 3axes
               Shock            0.5ms, 1500G, 3 axes
               Altitude         70,000 feet                                                                        MLC
               Part Number List
               Capacity               0ºC~+70ºC                 Capacity              -40ºC~+85ºC
                8GB            SBMSM008G-PKCTMAS-(W/T/WT)        8GB           WBMSM008G-PKCTMAS-(W/T/WT)C
               16GB            SBMSM016G-PKCTMAS-(W/T/WT)        16GB          WBMSM016G-PKCTMAS-(W/T/WT)C
               32GB            SBMSM032G-PKCTMAS-(W/T/WT)        32GB          WBMSM032G-PKCTMAS-(W/T/WT)C
               64GB            SBMSM064G-PKCTMAS-(W/T/WT)        64GB          WBMSM064G-PKCTMAS-(W/T/WT)C
               128GB           SBMSM128G-PKCTMAS-(W/T/WT)       128GB          WBMSM128G-PKCTMAS-(W/T/WT)C          3D-NAND
               256GB           SBMSM256G-PKCTMAS-(W/T/WT)       256GB          WBMSM256G-PKCTMAS-(W/T/WT)C

            Notes : C :  Special conformal coating treated on whole PCBA which may support wide temp. grade operating temperature -40°C ~ +85°C
               Part Number Decoder
              X1   X2  X3   X4   X5   X6   X7   X8  X9   X10  X11  X12  X13  X14  X15  X16  X17  X18  X19  X20
             Example                                                                                               Module  DRAM
              W    B    M    S   M    2    5    6    G         P   K    C    T    M    A    S        T    C


              X1  Grade                                      X13  Controller grade
             S : Standard grade operating temp. 0ºC~+70ºC    C : Commercial grade
             W : Wide temp. grade operating temp. -40ºC~+85ºC
                                                             X14  Flash IC brand
              X2  The material of casing
                                                             T :  Toshiba NAND flash IC                              Adapter
             B : Bare (without casing)
                                                             X15  Flash IC type
              X3   X4  X5  Product category
                                                             M : MLC-NAND flash IC
             MSM : Mini SATA Module (mSATA)
                                                             X16  X17  aSLC Technology
              X6   X7  X8   X9  Capacity
                                                             AS : aSLC Technology extends MLC products’ lifespan
             008G : 8GB  064G : 64GB                         X19  X20  Reserved for specific requirements
             016G : 16GB  128G : 128GB                                                                              Card-drive
             032G : 32GB  256G : 256GB                       Blank : Standard product w/o thermal sensor and conformal-coating
             X11  Controller                                 W : Write Protection Switch (optional)
                                                             T : Thermal Sensor (optional)
             P : PHANES Series                               WT : Write Protection Switch + Thermal Sensor (optional)
             X12  Controller version                         C : Conformal coating (optional)
             A, B, C, D…..






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                                            Product specifications are subject to change without prior notice.
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