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A19077     PHANES-K Series  3D-NAND mSATA III Half Size SSD (MSH)

                                                               Features
                                                                 TOSHIBA BiCS Flash™ (3D-NAND) technology
                                                                 Support Trim command set
                                                                 Support Native Command Queuing (NCQ)
                                                                 Support LDPC (Low Density Parity Check) ECC algorithm
                                                                 Support S.M.A.R.T. command set and utility
                                                                 Support Power Loss Protection
                                                                 Capacities from 32GB up to 128GB
               Specification
               Compatibility    SATA Revision 3.2              Power consumption
     SLC       Declarations     ATA-8 ACS4 command set         Power requirement  +3.3 V ± 5%
                                                              
                                 RoHS & REACH compliant
                                                                                 1,200 mW (Max.)
                                                                Reading mode
               Flash technology  3D-NAND flash technology       Writing mode    1,330 mW (Max.)
               Form-factor      mSATA mini form factor         Idle mode       300 mW (Max.)
                                 Compliant with JEDEC MO-300B    Reliability
               Host Interface   mini PCI-e connector with 52 pins SATA pin out   Wear-leveling  Static and Dynamic wear-leveling algorithms
               Performance                                     TBW             Up to 75 TBW at 128GB Capacity
               Data transfer rate  SATA 1.5Gb/s, 3.0Gb/s, 6.0Gb/s               (Client workload by JESD-219A)
     aSLC      Sequential read  550 MB/sec (Max.)              Erase counts    Up to 3,000 times
                                                              
             
                                                                                 LDPC (Low Density Parity Check)
                                                                ECC
                                 450 MB/sec (Max.)
               Sequential write
                                                              
               Environmental
             
                                                                Physical specification
               Operating temp.  STD. 0˚C~+70˚C/W.T. -40˚C~+85˚C    Weight (Max.)  3.5g
               Non-operating temp.  STD. -20˚C~+80˚C/W.T. -50˚C~+95˚C    Dimension (WxL)  29.85 x 26.80 (mm)
               Humidity         10% ~ 95% non-condensing       Conformal coating  Optional
               Vibration        80 Hz to 2K Hz, 20G, 3axes     Warranty        2 years or within 3,000 erasing counts
               Shock            0.5ms, 1500 G, 3 axes
             
               Altitude
                                 70,000 feet
     MLC       Part Number List
               Capacity               0ºC~+70ºC                 Capacity              -40ºC~+85ºC
               32GB                 SBMSH032G-PKCT3             32GB               WBMSH032G-PKCT3-C
                                                                64GB
               64GB                 SBMSH064G-PKCT3             128GB              WBMSH064G-PKCT3-C
               128GB
                                                                                   WBMSH128G-PKCT3-C
                                    SBMSH128G-PKCT3
     3D-NAND    Part Number Decoder  X5  X6  X7  X8  X9  X10  X11  X12  X13  X14  X15  X16  X17  X18  X19  X20
              X1
                       X3
                   X2
                            X4
             Example
              W    B    M    S   H    1    2    8    G         P   K    C    T    3         C
                                                                 Controller version
                 Grade
              X1
                                                             X12
    DRAM   Module  S : Standard grade operating temp. 0ºC~+70ºC  A, B, C, D…..
             W : Wide temp. grade operating temp. -40ºC~+85ºC
                                                                 Controller grade
                                                             X13
              X2
                 The material of casing
                                                             C : Commercial grade
             B : Bare (without casing)
                                                             X14  Flash IC brand
              X3   X4  X5  Product category                  T : Toshiba NAND flash IC
     Adapter  MSH : Mini SATA Module Half Size (mSATA mini)  3 : BiCS 3D-NAND Flash IC
                                                                 Flash IC type
                                                             X15
                                Capacity
                   X7
                       X8
                            X9
              X6
             032G : 32GB
             064G : 64GB                                     X17  X18  X19  X20  Reserved for specific requirements
             128G : 128GB                                    C : Conformal coating (optional)
                 Controller
     Card-drive  P : PHANES Series
             X11




                                                            99                             Updated on 191202-01
                                            Product specifications are subject to change without prior notice.
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