Page 107 - APRO_2019_Catalog

A19078 PHANES-K Series 3D-NAND M.2 2242 & 2280 SATA III SSD (MDS)

 Features
 TOSHIBA BiCS Flash™ (3D-NAND) technology
 M.2 2242 / 2280 form-factor
 Support Trim command set
 Support Native Command Queuing (NCQ)
 Support LDPC (Low Density Parity Check) ECC algorithm
 Support S.M.A.R.T. command set and utility
 Support Power Loss Protection
 M.2 2242 capacities from 32GB up to 128GB
 M.2 2280 capacities from 128GB up to 1TB
 Specification
 Compatibility SATA Revision 3.2  Power consumption
ATA-8 ACS4 command set  Power requirement +3.3V ± 5%
 Declarations RoHS & REACH compliant  Reading mode 2242 : 1,230 mW (Max.); 2280 : 1,475 mW (Max.) SLC
 Flash technology 3D-NAND flash technology  Writing mode 2242 : 1,336 mW (Max.); 2280 : 1,350 mW (Max.)
 Form-factor M.2 2242-D3-B-M  Idle mode 2242 : 290 mW (Max.); 2280 : 277 mW (Max.)
M.2 2280-D5-B-M  Reliability
 Host interface Compatible with PCI Express™ M.2  Wear-leveling Static and Dynamic wear-leveling algorithms
B + M Key  TBW Up to 835 TBW at 1TB Capacity
 Performance (Client workload by JESD-219A)
 Data transfer rate SATA 1.5Gb/s, 3.0Gb/s, 6.0Gb/s  Erase counts Up to 3,000 times
 Sequential read 2242 : 550 MB/s (Max.); 2280 : 550 MB/s(Max.)  ECC LDPC (Low Density Parity Check) aSLC
 Sequential write 2242 : 450 MB/s (Max.); 2280 : 500 MB/s(Max.)  Physical specification
 Environmental  Weight (Max.) 2242 : 5g
 Operating temp. STD. 0˚C~+70˚C/W.T. -40˚C~+85˚C 2280 : 8g
 Non-operating temp. STD. -20˚C~+80˚C/W.T. -50˚C~+95˚C  Dimension (WxL) 2242 : 22.00 x 42.00 (mm)
 Humidity 10% ~ 95% non-condensing 2280 : 22.00 x 80.00 (mm)
 Vibration 80 Hz to 2K Hz, 20G, 3axes  Conformal coating Optional
 Shock 0.5ms, 1500G, 3 axes  Warranty 2 years or within 3,000 erasing counts
 Altitude 70,000 feet MLC
 Part Number List
M.2 2242 SATA Module M.2 2280 SATA Module
Capacity 0ºC~+70ºC -40ºC~+85ºC Capacity 0ºC~+70ºC -40ºC~+85ºC
32GB SBMDS032G-PKCT34BM WBMDS032G-PKCT34BM-C 128GB SBMDS128G-PKCT38BM WBMDS128G-PKCT38BM-C
64GB SBMDS064G-PKCT34BM WBMDS064G-PKCT34BM-C 256GB SBMDS256G-PKCT38BM WBMDS256G-PKCT38BM-C
128GB SBMDS128G-PKCT34BM WBMDS128G-PKCT34BM-C 512GB SBMDS512G-PKCT38BM WBMDS512G-PKCT38BM-C 3D-NAND
1TB SBMDS001T-PKCT38BM WBMDS001T-PKCT38BM-C
 Part Number Decoder
X1 X2 X3 X4 X5 X6 X7 X8 X9 X10 X11 X12 X13 X14 X15 X16 X17 X18 X19 X20
Example 1
W B M D S 1 2 8 G P K C T 3 4 B M C
Example 2 Module DRAM
W B M D S 0 0 1 T P K C T 3 8 B M C

X1 Grade X13 Controller grade
S : Standard grade operating temp. 0ºC~+70ºC C : Commercial grade
W : Wide temp. grade operating temp. -40ºC~+85ºC
X14 Flash IC brand
X2 The material of casing Adapter
T : Toshiba NAND flash IC
B : Bare (without casing)
X15 Flash IC type
X3 X4 X5 Product category 3 : BiCS 3D-NAND Flash IC
MDS : M.2 SATA SSD
X16 X17 X18 Form-factor type
X6 X7 X8 X9 Capacity
4 : 2242 form factor
032G : 32GB 256G : 256GB 8 : 2280 form factor Card-drive
064G : 64GB 512G : 512GB BM : B + M Key
128G : 128GB 001T : 1TB
X20 Reserved for specific requirements
X11 Controller
C : Conformal coating (optional)
P : PHANES Series
X12 Controller version
A, B, C, D…..

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Product specifications are subject to change without prior notice.