Page 108 - APRO_2019_Catalog

A19079 MUSE-ER Series 3D-NAND M.2 2242 & 2280 SATA III SSD w/DRAM (MDS)

 Features
 TOSHIBA BiCS Flash™ (3D-NAND) technology
 Built with DRAM cache
 Support Trim command set
 Support Native Command Queuing (NCQ)
 Support LDPC (Low Density Parity Check) ECC algorithm.
 Support S.M.A.R.T. command set and utility
 Ultra-high random read/write speed
 M.2 2242 capacities from 128GB up to 512GB
 M.2 2280 capacities from 128GB up to 1TB
 Specification
 Compatibility SATA Revision 3.2  Power consumption
SLC  Declarations ATA-8 ACS4 command set  Power requirement +3.3V ± 5%

Reading mode
2242 : 560 mA (Max.); 2280 : 625 mA (Max.)
RoHS & REACH compliant
 Flash technology 3D-NAND flash technology  Writing mode 2242 : 740 mA (Max.); 2280 : 800 mA (Max.)
 Form-factor M.2 2242-D3-B-M  Idle mode 2242 : 220 mA (Max.); 2280 : 220 mA (Max.)
M.2 2280-D5-B-M  Reliability
 Host interface Compatible with PCI Express™ M.2  Wear-leveling Static wear-leveling algorithms
B + M Key  TBW Up to 1,172 TBW at 1TB Capacity
 Performance (Client workload by JESD-219A)
aSLC  Data transfer rate SATA 1.5Gb/s, 3.0Gb/s, 6.0Gb/s  Erase counts Up to 3,000 times
ECC
Sequential read
LDPC (Low Density Parity Check)


2242 : 560 MB/s (Max.); 2280 : 540 MB/s(Max.)
Sequential write
2242 : 510 MB/s (Max.); 2280 : 470 MB/s(Max.)

Physical specification

 4KB random read 2242 : 75K IOPS (Max.); 2280 : 89K IOPS (Max.)c  Weight (Max.) 2242 : 5g
 4KB random write 2242 : 66.6K IOPS (Max.); 2280 : 62.5K IOPS (Max.) 2280 : 8g
 Environmental  Dimension (WxL) 2242 : 22.00 x 42.00 (mm)
 Operating temp. STD. 0˚C~+70˚C/W.T. -40˚C~+85˚C 2280 : 22.00 x 80.00 (mm)
 Non-operating temp. STD. -20˚C~+80˚C/W.T. -50˚C~+95˚C  Conformal coating Optional
Humidity

10% ~ 95% non-condensing
2 years or within 3,000 erasing counts

Warranty
MLC  Vibration 70 Hz to 2K Hz, 20G, 3 axes

0.5ms, 1500G, 3 axes
Shock
 Altitude 70,000 feet

 Part Number List
M.2 2280 SATA Module
M.2 2242 SATA Module -40ºC~+85ºC Capacity 0ºC~+70ºC -40ºC~+85ºC
3D-NAND 128GB SBMDS128G-VECT34BM(T) WBMDS128G-VECT34BM(T)C 128GB SBMDS128G-VECT38BM(T) WBMDS128G-VECT38BM(T)C
0ºC~+70ºC
Capacity
SBMDS256G-VECT38BM(T)
WBMDS256G-VECT38BM(T)C
256GB
WBMDS256G-VECT34BM(T)C
256GB
SBMDS256G-VECT34BM(T)
512GB
WBMDS512G-VECT34BM(T)C
512GB
WBMDS512G-VECT38BM(T)C
SBMDS512G-VECT38BM(T)
SBMDS512G-VECT34BM(T)
 Part Number Decoder X5 X6 X7 X8 X9 X10 X11 1TB X12 SBMDS001T-VECT38BM(T) X16 WBMDS001T-VECT38BM(T)C
X19
X20
X15
X18
X17
X14
X13
X1
X3
X2
X4
DRAM Module Example 1 M D S 5 1 2 G V E C T 3 4 B M T C
B
W
Example 2
W B M D S 0 0 1 T V E C T 3 8 B M T C
Adapter S : Standard grade operating temp. 0ºC~+70ºC C : Commercial grade
Grade
Controller grade
X1
X13
W : Wide temp. grade operating temp. -40ºC~+85ºC
Flash IC brand
X14
The material of casing
X2
T : Toshiba NAND flash IC
B : Bare (without casing)
X15 Flash IC type
Card-drive MDS : M.2 SATA SSD X9 Capacity 4 : 2242 form factor Form-factor type
Product category
X5
X3
X4
3 : BiCS 3D-NAND Flash IC
X17
X18
X16
X7
X6
X8
128G : 128GB
512G : 512GB
8 : 2280 form factor
256G : 256GB
X11 Controller 001T : 1TB BM : B + M Key Reserved for specific requirements
X20
X19
V : MUSE Series Blank : Standard product w/o thermal sensor and conformal-coating
T : Thermal Sensor (optional)
X12 Controller version
C : Conformal coating (optional)
A, B, C, D…..
101 Updated on 191024-02
Product specifications are subject to change without prior notice.