Page 94 - APRO_2019_Catalog

A19067 HERMIT-E Series MLC USB 3.0 Flash Disk Generation 3EL (G3EL)

 Features

 MLC-NAND flash technology
 Semi-metal casing design
 Ultra-high random read/write speed
 Support S.M.A.R.T. command set and utility
 Customized logo by laser carving (MOQ requested)
 Capacities from 8GB up to 512GB
 Specification
 Compatibility USB 3.1  Power consumption
SLC  Declarations RoHS & REACH compliant  Power requirement 5V ± 10% via USB port

167.7 mA(Max.)
MLC-NAND flash technology
Flash technology

Reading mode
 Form-factor Pen drive  Writing mode 189 mA(Max.)
 Host interface 9 pins USB 3.0 Type A connector  Idle mode 42.8 mA(Max.)
 Performance  Reliability
 Data transfer rate FullSpeed, HighSpeed and SuperSpeed  Wear-leveling Dynamic, Static and Global wear-leveling
 Sequential read 97 MB/sec (Max.) algorithms
 Sequential write 60.2 MB/sec (Max.)  TBW Up to 125 TBW at 512GB Capacity
aSLC  4KB random read 11.3 MB/sec (Max.)  Erase counts (Client workload by JESD-219A)

4KB random write
6.4 MB/sec (Max.)
Up to 3,000 times
96 bits per 1024 bytes block
Environmental
ECC


 Operating temp. STD. 0˚C~+70˚C/W.T. -40˚C~+85˚C  Physical specification
 Non-operating temp. STD. -20˚C~+80˚C/W.T. -50˚C~+95˚C  Weight (Max.) 15g
 Humidity 10%~95% non-condensing  Dimension (WxLxH) 17.60 x 62.10 x 8.40 (mm).
 Vibration 70 Hz to 2K Hz, 15G, 3 axes  Conformal coating Optional
 Shock 0.5ms, 1500G, 3 axes  Warranty 2 years or within 3,000 erasing counts
Altitude

70,000 feet
MLC  OS supported Windows series Embedded O.S.
Linux, VxWorks and DOS
 Part Number List
-40ºC~+85ºC
0ºC~+70ºC
Capacity SMUFD008G-HECTMB3EL Capacity WMUFD008G-HECTMB3ELC
8GB
8GB
3D-NAND 128GB SMUFD016G-HECTMB3EL 128GB WMUFD016G-HECTMB3ELC
16GB
16GB
WMUFD032G-HECTMB3ELC
SMUFD032G-HECTMB3EL
32GB
32GB
WMUFD064G-HECTMB3ELC
64GB
64GB
SMUFD064G-HECTMB3EL
WMUFD128G-HECTMB3ELC
SMUFD128G-HECTMB3EL
256GB
WMUFD512G-HECTMB3ELC
SMUFD512G-HECTMB3EL
512GB
512GB SMUFD256G-HECTMB3EL 256GB WMUFD256G-HECTMB3ELC
 Part Number Decoder
DRAM Module Example X2 X3 X4 X5 X6 X7 X8 X9 X10 X11 X12 X13 X14 X15 X16 X17 X18 X19 X20
X1
M
E
C
H
L
C
E
B
3
T
M
5
1
U
F
D
G
W
2
Controller grade
X13
X1 Grade C : Commercial grade
S : Standard grade operating temp. 0ºC~+70ºC
Adapter W : Wide temp. grade operating temp. -40ºC~+85ºC T : Toshiba NAND flash IC
X14
Flash IC brand
The material of casing
X2
M : Semi-metal casing
X3 X4 X5 Product category X15 Flash IC type
M : MLC-NAND flash IC
UFD : USB Flash Disk Capacity X16 MLC Technology
Card-drive 008G : 8GB X8 128G : 128GB B : Toshiba 15nm MLC Housing Generation
X9
X6
X7
X19
X18
X17
256G : 256GB
016G : 16GB
032G : 32GB
512G : 512GB
3EL : Generation 3 housing extra Long type
064G : 64GB
X11 Controller X20 Reserved for specific requirements
C : Conformal coating (optional)
H : HERMIT Series
X12 Controller version
A, B, C, D…..
87
Product specifications are subject to change without prior notice.