Page 103 - APRO_2020_Catalog

A19074 PHANES-K Series 3D-NAND SATA III CFast™ Card (CFA)

 Features
 TOSHIBA BiCS Flash™ (3D-NAND) technology
 Optional rugged metal frame
 Support Trim command set
 Support Native Command Queuing (NCQ)
 Support LDPC (Low Density Parity Check) ECC algorithm
 Support S.M.A.R.T. command set and utility
 Support Power Loss Protection
 Capacities from 64GB up to 128GB
 Specification
 Compatibility SATA Revision 3.2  Power consumption
CFast™ Specification v2.0  Power requirement +3.3V±5%
ATA-8 ACS4 command set  Reading mode 1,270 mW (Max.) SLC
 Declarations RoHS & REACH compliant  Writing mode 1,360 mW (Max.)
 Flash technology TOSHIBA BiCS Flash™ (3D-NAND flash)  Idle mode 325 mW (Max.)
 Form-factor CFast™ Type I  Reliability
 Host Interface 7 pins (data) + 17 pins (power)  Wear-leveling Static and Dynamic wear-leveling algorithms
CFast™ connector  TBW Up to 75 TBW at 128GB Capacity
 Performance (Client workload by JESD-219A)
 Data transfer rate SATA 1.5Gb/s, 3.0Gb/s, 6.0Gb/s  Erase counts Up to 3,000 times
 Sequential read 550 MB/sec (Max.)  ECC LDPC (Low Density Parity Check) aSLC
 Sequential write 450 MB/sec (Max.)  Physical specification
 Environmental  Weight (Max.) Plastic frame : 10g
 Operating temp. STD. 0˚C~+70˚C/W.T. -40˚C~+85˚C Rugged metal frame : 13g
 Non-operating temp. STD. -20˚C~+80˚C/W.T. -50˚C~+95˚C  Dimension (WxLxH) 42.8 x 36.4 x 3.5 (mm)
 Humidity 10% ~ 95% non-condensing  Conformal coating Optional
 Vibration 80 Hz to 2K Hz, 20G, 3axes  Warranty 2 years or within 3,000 erasing counts
 Shock 0.5ms, 1500 G, 3 axes
 Altitude 70,000 feet MLC
 Part Number List
Standard plastic frame CFA Optional rugged metal CFA
Capacity 0ºC~+70ºC -40ºC~+85ºC Capacity 0ºC~+70ºC -40ºC~+85ºC
64GB SPCFA064G-PKCT3 WPCFA064G-PKCT3-C 64GB SRCFA064G-PKCT3 WRCFA064G-PKCT3-C
128GB SPCFA128G-PKCT3 WPCFA128G-PKCT3-C 128GB SRCFA128G-PKCT3 WRCFA128G-PKCT3-C

 Part Number Decoder 3D-NAND
X1 X2 X3 X4 X5 X6 X7 X8 X9 X10 X11 X12 X13 X14 X15 X16 X17 X18 X19 X20
Example
W R C F A 1 2 8 G P K C T 3 C

X1 Grade X12 Controller version Module DRAM
S : Standard grade operating temp. 0ºC~+70ºC A, B, C, D…..
W : Wide temp. grade operating temp. -40ºC~+85ºC
X13 Controller grade
X2 The material of casing
C : Commercial grade
P : Plastic frame X14 Flash IC brand
R : Rugged metal frame
X3 X4 X5 Product category T : Toshiba NAND flash IC
X15 Flash IC type Adapter
CFA : CFast™ card
3 : BiCS 3D-NAND Flash IC
X6 X7 X8 X9 Capacity
X17 X18 X19 X20 Reserved for specific requirements
064G : 64GB
128G : 128GB C : Conformal coating (optional)
X11 Controller
P : PHANES Series Card-drive

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Product specifications are subject to change without prior notice.